Samsung HBM3E Memory Chips Approved for Nvidia AI Processors

Samsung Electronics has successfully passed Nvidia`s tests for its eight-layer HBM3E memory chips, paving the way for their use in Nvidia`s AI processors. While a formal supply agreement is expected soon, with shipments projected to commence by late 2024, Samsung`s 12-layer version has yet to receive Nvidia`s approval. This development marks a significant step for Samsung, which has been trailing behind competitor SK Hynix in the advanced memory chip market crucial for AI applications. Although Samsung faced earlier setbacks due to technical challenges, it has reportedly refined its HBM3E design. Despite this progress, industry analysts observe that Samsung still lags behind SK Hynix, which is simultaneously preparing to launch its 12-layer HBM3E chips.